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November 2006
HYI25D512160C[C/E/F/T]
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5 1 2 - M b i t D o u b l e - D a t a - R a t e SD R A M DDR SDRAM
Internet Data Sheet
Rev. 1.0
Internet Data Sheet
HYI25D512160C[C/E/F/T] 512-Mbit Double-Data-Rate SDRAM
HYI25D512160C[C/E/F/T] Revision History: 2006-11, Rev. 1.0 Page
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HYI25D512160C[C/E/F/T] 512-Mbit Double-Data-Rate SDRAM
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Overview
This chapter gives an overview of the 512-Mbit Double-Data-Rate SDRAM product family and describes its main characteristics.
1.1
* * * * * * * * * * * * * * * * * *
Features
Double data rate architecture: two data transfers per clock cycle Bidirectional data strobe (DQS) is transmitted and received with data, to be used in capturing data at the receiver DQS is edge-aligned with data for reads and is center-aligned with data for writes Differential clock inputs (CK and CK) Four internal banks for concurrent operation Data mask (DM) for write data DLL aligns DQ and DQS transitions with CK transitions Commands entered on each positive CK edge; data and data mask referenced to both edges of DQS Burst Lengths: 2, 4, or 8 CAS Latency: 2, 2.5, 3 Auto Precharge option for each burst access Auto Refresh and Self Refresh Modes RAS-lockout supported tRAP= tRCD 7.8 s Maximum Average Periodic Refresh Interval 2.5 V (SSTL_2 compatible) I/O VDDQ = 2.5 V 0.2 V VDD = 2.5 V 0.2 V Packages : P-TSOPII-66, PG-TSOPII-66, P-TFBGA-60, PG-TFBGA-60
TABLE 1
Performance for -5 and -6
Part Number Speed Code Speed Grade Max. Clock Frequency Component @CL3 @CL2.5 @CL2 -5 DDR400B -6 DDR333B 166 166 133 Unit -- MHz MHz MHz
fCK3 fCK2.5 fCK2
200 166 133
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1.2
Description
Read and write accesses to the DDR SDRAM are burst oriented; accesses start at a selected location and continue for a programmed number of locations in a programmed sequence. Accesses begin with the registration of an Active command, which is then followed by a Read or Write command. The address bits registered coincident with the Active command are used to select the bank and row to be accessed. The address bits registered coincident with the Read or Write command are used to select the bank and the starting column location for the burst access. The DDR SDRAM provides for programmable Read or Write burst lengths of 2, 4 or 8 locations. An Auto Precharge function may be enabled to provide a self-timed row precharge that is initiated at the end of the burst access. As with standard SDRAMs, the pipelined, multibank architecture of DDR SDRAMs allows for concurrent operation, thereby providing high effective bandwidth by hiding row precharge and activation time. An auto refresh mode is provided along with a power-saving power-down mode. All inputs are compatible with the Industry Standard for SSTL_2. All outputs are SSTL_2, Class II compatible. Note: The functionality described and the timing specifications included in this data sheet are for the DLL Enabled mode of operation.
The 512-Mbit Double-Data-Rate SDRAM is a high-speed CMOS, dynamic random-access memory containing 536,870,912 bits. It is internally configured as a quad-bank DRAM. The 512-Mbit Double-Data-Rate SDRAM uses a doublewww..com architecture to achieve high-speed operation. The data-rate double data rate architecture is essentially a 2n prefetch architecture with an interface designed to transfer two data words per clock cycle at the I/O pins. A single read or write access for the 512-Mbit Double-Data-Rate SDRAM effectively consists of a single 2n-bit wide, one clock cycle data transfer at the internal DRAM core and two corresponding n-bit wide, one-half-clock-cycle data transfers at the I/O pins. A bidirectional data strobe (DQS) is transmitted externally, along with data, for use in data capture at the receiver. DQS is a strobe transmitted by the DDR SDRAM during Reads and by the memory controller during Writes. DQS is edge-aligned with data for Reads and center-aligned with data for Writes. The 512-Mbit Double-Data-Rate SDRAM operates from a differential clock (CK and CK; the crossing of CK going HIGH and CK going LOW is referred to as the positive edge of CK). Commands (address and control signals) are registered at every positive edge of CK. Input data is registered on both edges of DQS, and output data is referenced to both edges of DQS, as well as to both edges of CK.
TABLE 2
Ordering Information for non RoHS Compliant Products
Part Number1) HYI25D512160CC-5 HYI25D512160CT-5 HYI25D512160CC-6 HYI25D512160CT-6
1) HYI: designator for memory components 25D : DDR SDRAMs at VDDQ = 2.5 V 512: 512-Mbit density 160: Product variation x16 C: Die revision C C/F/E/T: Package type FBGA and TSOP
Org. x16
CAS-RCD-RP Latencies 3.0-3-3 2.5-3-3
Clock (MHz) 200 166
CAS-RCD-RP Latencies 2.5-3-3 2.0-3-3
Clock (MHz) 166 133
Speed DDR400B DDR333
Package P-TFBGA-60 P-TSOPII-66 P-TFBGA-60 P-TSOPII-66
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TABLE 3
Ordering Information for RoHS Compliant Products
Part Number www..com Org. CAS-RCD-RP Clock Latencies (MHz) 3.0-3-3 2.5-3-3 200 166 CAS-RCD-RP Clock Latencies (MHz) 2.5-3-3 2.0-3-3 166 133 Speed Package Note
1)
HYI25D512160CE-5 x16 HYI25D512160CF-5 HYI25D512160CE-6 HYI25D512160CF-6
DDR400B PG-TSOPII-66 PG-TFBGA-60 DDR333 PG-TSOPII-66 PG-TFBGA-60
1) RoHS Compliant Product: Restriction of the use of certain hazardous substances (RoHS) in electrical and electronic equipment as defined in the directive 2002/95/EC issued by the European Parliament and of the Council of 27 January 2003. These substances include mercury, lead, cadmium, hexavalent chromium, polybrominated biphenyls and polybrominated biphenyl ethers.
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Chip Configuration
The pin configuration of a DDR SDRAM is listed by function in Table 4 (60 pins). The abbreviations used in the Pin#/Buffer# column are www..com explained in Table 5 and Table 6 respectively. The pin numbering for FBGA is depicted in Figure 1 and that of the TSOP package in Figure 2.
TABLE 4
Ball Configuration of DDR SDRAM
Ball#/Pin# Clock Signals G2, 45 G3, 46 H3, 44 Control Signals H7, 23 G8, 22 G7, 21 H8, 24 J8, 26 J7, 27 K7, 29 L8, 30 L7, 31 M8, 32 M2, 35 L3, 36 L2, 37 K3, 38 K2, 39 J3, 40 K8, 28 J2, 41 H2, 42 RAS CAS WE CS BA0 BA1 A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 AP A11 A12 NC I I I I I I I I I I I I I I I I I I I I NC SSTL SSTL SSTL SSTL SSTL SSTL SSTL SSTL SSTL SSTL SSTL SSTL SSTL SSTL SSTL SSTL SSTL SSTL SSTL SSTL -- Address Signal 12 Note: Module based on 256 Mbit or larger dies Note: Module based on 128 Mbit or smaller dies Address Bus 11:0 Row Address Strobe Column Address Strobe Write Enable Chip Select Bank Address Bus 2:0 CK1 CK1 CKE I I I SSTL SSTL SSTL Clock Signal Complementary Clock Signal Clock Enable Name Pin Type Buffer Type Function
Address Signals
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Ball#/Pin# F9, 17
Name A13 NC
Pin Type I NC I/O I/O I/O I/O I/O I I/O I/O I/O I/O I/O I/O I/O I/O I/O I
Buffer Type SSTL -- SSTL SSTL SSTL SSTL SSTL SSTL SSTL SSTL SSTL SSTL SSTL SSTL SSTL SSTL SSTL SSTL
Function Address Signal 13 Note: 1 Gbit based module Note: Module based on 512 Mbit or smaller dies Data Signal Bus 3:0
Data Signals x4 organization
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B7, 5
DQ0 DQ1 DQ2 DQ3 DQS DM DQ0 DQ1 DQ2 DQ3 DQ4 DQ5 DQ6 DQ7 DQS DM
D7, 11 D3, 56 B3, 62 E3, 51 F3, 47 A8, 2 B7, 5 C7, 8 D7, 11 D3, 56 C3, 59 B3, 62 A2, 65 E3, 51 F3, 47
Data Strobe x4 organisation Data Strobe Data Mask Data Signal Bus 7:0 Data Mask x4 organization Data Signals x8 organization
Data Strobe x8 organisation Data Strobe Data Mask Data Mask x8 organization
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HYI25D512160C[C/E/F/T] 512-Mbit Double-Data-Rate SDRAM
Ball#/Pin#
Name
Pin Type I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I I AI PWR
Buffer Type SSTL SSTL SSTL SSTL SSTL SSTL SSTL SSTL SSTL SSTL SSTL SSTL SSTL SSTL SSTL SSTL SSTL SSTL SSTL SSTL -- --
Function
Data Signals x16 organization A8, 2 B9, 4
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DQ0 DQ1 DQ2 DQ3 DQ4 DQ5 DQ6 DQ7 DQ8 DQ9 DQ10 DQ11 DQ12 DQ13 DQ14 DQ15 UDQS LDQS UDM LDM VREF
Data Signal 15:0
B7, 5
C9, 7 C7, 8
D9, 10 D7, 11 E9, 13 E1, 54 D3, 56 D1, 57 C3, 59 C1, 60 B3, 62 B1, 63 A2, 65 E3, 51 E7, 16 F3, 47 F7, 20 Power Supplies F1, 49
Data Strobe x16 organization Data Strobe Upper Byte Data Strobe Lower Byte Data Mask Upper Byte Data Mask Lower Byte I/O Reference Voltage I/O Driver Power Supply
Data Mask x16 organization
A9, B2, C8, D2, VDDQ E8, 3, 9, 15, 55, 61 A7, F8, M7, 1, 18, 33 VDD
PWR PWR
-- --
Power Supply Power Supply
A1, B8, C2, D8, VSSQ E2, 6, 12, 52, 58, 64 A3, F2, M3, 34 Not Connected A2, 65 A8, 2 B1, 63 NC NC NC VSS
PWR NC NC NC
-- -- -- --
Power Supply Not Connected Note: x4 organization Not Connected Note: x4 organization Not Connected Note: x8 and x4 organisation
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Ball#/Pin# B9, 4 C1, 60
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Name NC NC NC NC NC NC NC NC NC NC NC NC
Pin Type NC NC NC NC NC NC NC NC NC NC NC NC
Buffer Type -- -- -- -- -- -- -- -- -- -- -- --
Function Not Connected Note: x8 and x4 organization Not Connected Note: x8 and x4 organization Not Connected Note: x4 organization Not Connected Note: x4 organization Not Connected Note: x8 and x4 organization Not Connected Note: x8 and x4 organization Not Connected Note: x8 and x4 organization Not Connected Note: x8 and x4 organization Not Connected Note: x8 and x4 organization Not Connected Note: x8 and x4 organization Not Connected Note: x8 and x4 organization Not Connected Note: x16,x8 and x4 organization
C3, 59 C7, 8 C9, 7 D1, 57 D9, 10 E1, 54 E7, 16 E9, 13 F7, 20
14, 17, 19, 25, 43, 50
TABLE 5
Abbreviations for Pin Type
Abbreviation I O I/O AI PWR GND NC Description Standard input-only pin. Digital levels. Output. Digital levels. I/O is a bidirectional input/output signal. Input. Analog levels. Power Ground Not Connected (JEDEC Standard)
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TABLE 6
Abbreviations for Buffer Type
Abbreviation SSTL LV-CMOS
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Description Serial Stub Terminalted Logic (SSTL2) Low Voltage CMOS CMOS Levels Open Drain. The corresponding pin has 2 operational states, active low and tristate, and allows multiple devices to share as a wire-OR.
CMOS OD
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FIGURE 1
Pin Configuration P(G)-TFBGA-60 Top View, see the balls throught the package
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FIGURE 2
Pin Configuration P(G)-TSOPII-66
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Functional Description
Read and write accesses to the DDR SDRAM are burst oriented; accesses start at a selected location and continue for a programmed number of locations in a programmed sequence. Accesses begin with the registration of an Active command, which is then followed by a Read or Write command. The address bits registered coincident with the Active command are used to select the bank and row to be accessed (BA0, BA1 select the bank; A0-A12 select the row). The address bits registered coincident with the Read or Write command are used to select the starting column location for the burst access. Prior to normal operation, the DDR SDRAM must be initialized. The following sections provide detailed information covering device initialization, register definition, command descriptions and device operation.
The 512-Mbit Double-Data-Rate SDRAM is a high-speed CMOS, dynamic random-access memory containing 536,870,912 bits. The 512-Mbit Double-Data-Rate SDRAM www..com is internally configured as a quad-bank DRAM. The 512-Mbit Double-Data-Rate SDRAM uses a doubledata-rate architecture to achieve high-speed operation. The double-data-rate architecture is essentially a 2n prefetch architecture, with an interface designed to transfer two data words per clock cycle at the I/O pins. A single read or write access for the 512-Mbit Double-Data-Rate SDRAM consists of a single 2n-bit wide, one clock cycle data transfer at the internal DRAM core and two corresponding n-bit wide, onehalf clock cycle data transfers at the I/O pins.
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TABLE 7
Mode Register Definition
Field BL Bits [2:0] Type1) w Description Burst Length Number of sequential bits per DQ related to one read/write command. Note: All other bit combinations are RESERVED. 001B 2 010B 4 011B 8 BT 3 Burst Type See Table 8 for internal address sequence of low order address bits. Sequential 0B 1B Interleaved CAS Latency Number of full clocks from read command to first data valid window. Note: All other bit combinations are RESERVED. 010B 2 011B 3 110B 2.5 MODE [12:7] Operating Mode Note: All other bit combinations are RESERVED. 000000B 000010B
1) w = write only register bit
CL
[6:4]
Normal Operation without DLL Reset Normal DLL Reset
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TABLE 8
Burst Definition
Burst Length Starting Column Address A2
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Order of Accesses Within a Burst Type = Sequential 0-1 1-0 0-1-2-3 1-2-3-0 2-3-0-1 3-0-1-2 0-1-2-3-4-5-6-7 1-2-3-4-5-6-7-0 2-3-4-5-6-7-0-1 3-4-5-6-7-0-1-2 4-5-6-7-0-1-2-3 5-6-7-0-1-2-3-4 6-7-0-1-2-3-4-5 7-0-1-2-3-4-5-6 Type = Interleaved 0-1 1-0 0-1-2-3 1-0-3-2 2-3-0-1 3-2-1-0 0-1-2-3-4-5-6-7 1-0-3-2-5-4-7-6 2-3-0-1-6-7-4-5 3-2-1-0-7-6-5-4 4-5-6-7-0-1-2-3 5-4-7-6-1-0-3-2 6-7-4-5-2-3-0-1 7-6-5-4-3-2-1-0
A1
A0 0 1
2
4
0 0 1 1
0 1 0 1 0 1 0 1 0 1 0 1
8
0 0 0 0 1 1 1 1
0 0 1 1 0 0 1 1
Notes 1. 2. 3. 4. For a burst length of two, A1-Ai selects the two-data-element block; A0 selects the first access within the block. For a burst length of four, A2-Ai selects the four-data-element block; A0-A1 selects the first access within the block. For a burst length of eight, A3-Ai selects the eight-data- element block; A0-A2 selects the first access within the block. Whenever a boundary of the block is reached within a given sequence above, the following access wraps within the block.
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TABLE 9
Extended Mode Register
Bits 0 Type1) w Description DLL Status 0B Enabled 1B Disabled Drive Strength Normal 0B 1B Weak Operating Mode 00000000000 B Normal Operation Notes 1. A2 must be 0 to provide compatibility with early DDR devices 2. All other bit combinations are RESERVED
Field DLL
DS
1
MODE
[12:3]
1) w = write only register bit
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TABLE 10
Truth Table 1a: Commands
Name (Function) Deselect (NOP) No Operation (NOP)
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CS H L L L L L L L L
RAS X H L H H H L L L
CAS X H H L L H H L L
WE X H H H L L L H L
Address X X Bank/Row Bank/Col Bank/Col X Code X Op-Code
MNE NOP NOP ACT Read Write BST PRE AR/SR MRS
Note
1)2) 1)2) 1)3) 1)4) 1)4) 1)5) 1)6) 1)7)8) 1)9)
Active (Select Bank And Activate Row) Read (Select Bank And Column, And Start Read Burst) Write (Select Bank And Column, And Start Write Burst) Burst Terminate Precharge (Deactivate Row In Bank Or Banks) Auto Refresh Or Self Refresh (Enter Self Refresh Mode) Mode Register Set
1) 2) 3) 4) 5) 6) 7) 8) 9)
CKE is HIGH for all commands shown exceptSelf Refresh. VREF must be maintained during Self Refresh operation. Deselect and NOP are functionally interchangeable. BA0-BA1 provide bank address and A0-A12 provide row address. BA0, BA1 provide bank address; A0-Ai provide column address (where i = 8 for x16, i = 9 for x8 and 9, 11 for x4); A10 HIGH enables the Auto Precharge feature (nonpersistent), A10 LOW disables the Auto Precharge feature. Applies only to read bursts with Auto Precharge disabled; this command is undefined (and should not be used) for read bursts with Auto Precharge enabled or for write bursts. A10 LOW: BA0, BA1 determine which bank is precharged. A10 HIGH: all banks are precharged and BA0, BA1 are "Don't Care". This command is AUTO REFRESH if CKE is HIGH; Self Refresh if CKE is LOW. Internal refresh counter controls row and bank addressing; all inputs and I/Os are "Don't Care" except for CKE. BA0, BA1 select either the Base or the Extended Mode Register (BA0 = 0, BA1 = 0 selects Mode Register; BA0 = 1, BA1 = 0 selects Extended Mode Register; other combinations of BA0-BA1 are reserved; A0-A12 provide the op-code to be written to the selected Mode Register).
TABLE 11
Truth Table 1b: DM Operation
Name (Function) Write Enable Write Inhibit
1) Used to mask write data; provided coincident with the corresponding data.
DM L H
DQs Valid X
Note
1) 1)
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TABLE 12
Truth Table 2: Clock Enable (CKE)
Current State CKE n-1 Previous Cycle
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CKEn Current Cycle L H L H L L L H
Command n
Action n
Note
Self Refresh Self Refresh Power Down Power Down All Banks Idle All Banks Idle Bank(s) Active
L L L L H H H H
X Deselect or NOP X Deselect or NOP Deselect or NOP AUTO REFRESH Deselect or NOP See Table 13
Maintain Self-Refresh Exit Self-Refresh Maintain Power-Down Exit Power-Down Precharge Power-Down Entry Self Refresh Entry Active Power-Down Entry -
1) 2)
1) VREF must be maintained during Self Refresh operation 2) Deselect or NOP commands should be issued on any clock edges occurring during the Self Refresh Exit (VXSNR) period. A minimum of 200 clock cycles are needed before applying a read command to allow the DLL to lock to the input clock.
Notes 1. 2. 3. 4. CKEn is the logic state of CKE at clock edge n: CKE n-1 was the state of CKE at the previous clock edge. Current state is the state of the DDR SDRAM immediately prior to clock edge n. COMMAND n is the command registered at clock edge n, and ACTION n is a result of COMMAND n. All states and sequences not shown are illegal or reserved.
TABLE 13
Truth Table 3: Current State Bank n - Command to Bank n (same bank)
Current State Any Idle CS H L L L L Row Active L L L Read (Auto Precharge Disabled) Write (Auto Precharge Disabled) L L L L L L RAS X H L L L H H L H L H H H L CAS X H H L L L L H L H H L L H WE X H H H L H L L H L L H L L Command Deselect No Operation Active AUTO REFRESH MODE REGISTER SET Read Write Precharge Read Precharge BURST TERMINATE Read Write Precharge Action NOP. Continue previous operation. NOP. Continue previous operation. Select and activate row - - Select column and start Read burst Select column and start Write burst Deactivate row in bank(s) Select column and start new Read burst Truncate Read burst, start Precharge BURST TERMINATE Select column and start Read burst Select column and start Write burst Truncate Write burst, start Precharge Note
1)2)3)4)5)6) 1) to 6) 1) to 6) 1) to 7) 1) to 7)
1) to 6), 8) 1) to 6), 8) 1) to 6), 9) 1) to 6), 8) 1) to 6), 9) 1) to 6), 10)
1) to 6), 8), 11) 1) to 6), 8) 1) to 6), 9), 10)
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1) This table applies when CKE n-1 was HIGH and CKE n is HIGH (see Table 12 and after tXSNR/tXSRD has been met (if the previous state was self refresh). 2) This table is bank-specific, except where noted, i.e., the current state is for a specific bank and the commands shown are those allowed to be issued to that bank when in that state. Exceptions are covered in the notes below. 3) Current state definitions: Idle: The bank has been precharged, and tRP has been met. Row Active: A row in the bank has been activated, and tRCD has been met. No data bursts/accesses and no register accesses are in progress. Read: A Read burst has been initiated, with Auto Precharge disabled, and has not yet terminated or been terminated. Write: A Write burst has been initiated, with Auto Precharge disabled, and has not yet terminated or been terminated. www..com 4) The following states must not be interrupted by a command issued to the same bank. Precharging: Starts with registration of a Precharge command and ends when tRP is met. Once tRP is met, the bank is in the idle state. Row Activating: Starts with registration of an Active command and ends when tRCD is met. Once tRCD is met, the bank is in the "row active" state. Read w/Auto Precharge Enabled: Starts with registration of a Read command with Auto Precharge enabled and ends when tRP has been met. Once tRP is met, the bank is in the idle state. Write w/Auto Precharge Enabled: Starts with registration of a Write command with Auto Precharge enabled and ends when tRP has been met. Once tRP is met, the bank is in the idle state. Deselect or NOP commands, or allowable commands to the other bank should be issued on any clock edge occurring during these states. Allowable commands to the other bank are determined by its current state and according to Table 14. 5) The following states must not be interrupted by any executable command; Deselect or NOP commands must be applied on each positive clock edge during these states. Refreshing: Starts with registration of an Auto Refresh command and ends when tRFC is met. Once tRFC is met, the DDR SDRAM is in the "all banks idle" state. Accessing Mode Register: Starts with registration of a Mode Register Set command and ends when tMRD has been met. Once tMRD is met, the DDR SDRAM is in the "all banks idle" state. Precharging All: Starts with registration of a Precharge All command and ends when tRP is met. Once tRP is met, all banks is in the idle state. 6) All states and sequences not shown are illegal or reserved. 7) Not bank-specific; requires that all banks are idle. 8) Reads or Writes listed in the Command/Action column include Reads or Writes with Auto Precharge enabled and Reads or Writes with Auto Precharge disabled. 9) May or may not be bank-specific; if all/any banks are to be precharged, all/any must be in a valid state for precharging. 10) Not bank-specific; BURST TERMINATE affects the most recent Read burst, regardless of bank. 11) Requires appropriate DM masking.
TABLE 14
Truth Table 4: Current State Bank n - Command to Bank m
Current State Any Idle CS H L X RAS CAS WE X H X X H X X H X Command Deselect No Operation Any Command Otherwise Allowed to Bank m Active Read Write Precharge Active Read Precharge Active Read Write Precharge Action NOP. Continue previous operation. NOP. Continue previous operation. - Note
1)2)3)4)5)6) 1) to 6) 1) to 6)
Row Activating, Active, or Precharging
L L L L L L L L L L L
L H H L L H L L H H L
H L L H H L H H L L H
H H L L H H L H H L L
Select and activate row Select column and start Read burst Select column and start Write burst - Select and activate row Select column and start new Read burst - Select and activate row Select column and start Read burst Select column and start new Write burst -
1) to 6) 1) to 7) 1) to 7) 1) to 6) 1) to 6) 1) to 7) 1) to 6) 1) to 6) 1) to 8) 1) to 7) 1) to 6)
Read (Auto Precharge Disabled) Write (Auto Precharge Disabled)
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Current State Read (With Auto Precharge)
CS L L L L
RAS CAS WE L H H L L H H L H L L H H L L H H H L L H H L L
Command Active Read Write Precharge Active Read Write Precharge
Action Select and activate row Select column and start new Read burst Select column and start Write burst - Select and activate row Select column and start Read burst Select column and start new Write burst -
Note
1) to 6) 1) to 7), 9) 1) to 7), 9), 10) 1) to 6) 1) to 6) 1) to 7), 9) 1) to 7), 9) 1) to 6)
Write (With Auto www..com Precharge)
L L L L
1) This table applies when CKE n-1 was HIGH and CKE n is HIGH (see Table 12: Clock Enable (CKE) and after tXSNR/tXSRD has been met (if the previous state was self refresh). 2) This table describes alternate bank operation, except where noted, i.e., the current state is for bank n and the commands shown are those allowed to be issued to bank m (assuming that bank m is in such a state that the given command is allowable). Exceptions are covered in the notes below. 3) Current state definitions: Idle: The bank has been precharged, and tRP has been met. Row Active: A row in the bank has been activated, and tRCD has been met. No data bursts/accesses and no register accesses are in progress. Read: A Read burst has been initiated, with Auto Precharge disabled, and has not yet terminated or been terminated. Write: A Write burst has been initiated, with Auto Precharge disabled, and has not yet terminated or been terminated. Read with Auto Precharge Enabled: See 10). Write with Auto Precharge Enabled: See 10). 4) AUTO REFRESH and Mode Register Set commands may only be issued when all banks are idle. 5) A BURST TERMINATE command cannot be issued to another bank; it applies to the bank represented by the current state only. 6) All states and sequences not shown are illegal or reserved. 7) Reads or Writes listed in the Command/Action column include Reads or Writes with Auto Precharge enabled and Reads or Writes with Auto Precharge disabled. 8) Requires appropriate DM masking. 9) Concurrent Auto Precharge: This device supports "Concurrent Auto Precharge". When a read with auto precharge or a write with auto precharge is enabled any command may follow to the other banks as long as that command does not interrupt the read or write data transfer and all other limitations apply (e.g. contention between READ data and WRITE data must be avoided). The minimum delay from a read or write command with auto precharge enable, to a command to a different banks is summarized in Table 15. 10) A Write command may be applied after the completion of data output.
TABLE 15
Truth Table 5: Concurrent Auto Precharge
From Command WRITE w/AP To Command (different bank) Read or Read w/AP Write to Write w/AP Precharge or Activate Read w/AP Read or Read w/AP Write or Write w/AP Precharge or Activate Minimum Delay with Concurrent Auto Unit Precharge Support 1 + (BL/2) + tWTR BL/2 1 BL/2 CL (rounded up) + BL/2 1 tCK tCK tCK tCK tCK tCK
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HYI25D512160C[C/E/F/T] 512-Mbit Double-Data-Rate SDRAM
4
4.1
Electrical Characteristics
Operating Conditions
TABLE 16
Absolute Maximum Ratings
This chapter describes the electrical characteristics.
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This chapter contains the operating conditions.
Parameter
Symbol Min.
Values Typ. -- -- -- -- -- -- 1 50 Max.
Unit
Note/ Test Condition -- -- -- -- -- -- -- --
Voltage on I/O pins relative to VSS Voltage on inputs relative to VSS Voltage on VDD supply relative to VSS Voltage on VDDQ supply relative to VSS Operating temperature (ambient) Storage temperature (plastic) Power dissipation (per SDRAM component) Short circuit output current
VIN, VOUT VIN VDD VDDQ TA TSTG PD IOUT
-0.5 -1 -1 -1 -40 -55 -- --
VDDQ + 0.5
+3.6 +3.6 +3.6 +85 +150 -- --
V V V V C C W mA
Attention: Stresses above the max. values listed here may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Maximum ratings are absolute ratings; exceeding only one of these values may cause irreversible damage to the integrated circuit.
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TABLE 17
Input and Output Capacitances
Parameter Symbol Min.
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Values Typ. -- -- -- -- -- -- -- -- -- Max. 3.0 2.5 0.25 2.5 3.0 0.5 4.5 5.0 0.5
Unit
Note/ Test Condition TSOPII1) TFBGA 1)
1)
Input Capacitance: CK, CK
CI1 CdI1 CI2 CdIO CIO CdIO
2.0 1.5 -- 1.5 2.0 -- 3.5 4.0 --
pF pF pF pF pF pF pF pF pF
Delta Input Capacitance Input Capacitance: All other input-only pins Delta Input Capacitance: All other input-only pins Input/Output Capacitance: DQ, DQS, DM Delta Input/Output Capacitance: DQ, DQS, DM
TFBGA 1) TSOPII 1)
1)
TFBGA 1)2) TSOPII 1)2)
1)
1) These values are guaranteed by design and are tested on a sample base only. VDDQ = VDD = 2.5 V 0.2 V, f = 100 MHz, TA = 25 C, VOUT(DC) = VDDQ/2, VOUT (Peak to Peak) 0.2 V. Unused pins are tied to ground. 2) DM inputs are grouped with I/O pins reflecting the fact that they are matched in loading to DQ and DQS to facilitate trace matching at the board level.
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TABLE 18
Electrical Characteristics and DC Operating Conditions
Parameter Symbol Min.
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Values Typ. 2.5 2.6 2.5 2.6 -- 0.5 x VDDQ -- -- -- -- -- -- -- -- -- -- Max. 2.7 2.7 2.7 2.7 0 0.51 x VDDQ VREF + 0.04 VDDQ + 0.3 VREF - 0.15 VDDQ + 0.3 VDDQ + 0.6 1.4 2 5 -16.2 --
Unit Note1)/ Test Condition
Device Supply Voltage Device Supply Voltage
Output Supply Voltage Output Supply Voltage Supply Voltage, I/O Supply Voltage Input Reference Voltage I/O Termination Voltage (System) Input High (Logic1) Voltage
VDD VDD VDDQ VDDQ VSS, VSSQ VREF VTT
2.3 2.5 2.3 2.5 0 0.49 x VDDQ VREF - 0.04 VREF + 0.15 -0.3 -0.3 0.36 0.71 -2 -5 -- 16.2
V V V V V V V V V V V -- A A mA mA
fCK 166 MHz fCK > 166 MHz 2) fCK 166 MHz 3) fCK > 166 MHz 2)3)
--
4) 5)
VIH(DC) Input Low (Logic0) Voltage VIL(DC) Input Voltage Level, CK and VIN(DC)
CK Inputs Input Differential Voltage, CK and CK Inputs VI-Matching Pull-up Current to Pull-down Current Input Leakage Current Output Leakage Current
6) 6) 6)
VID(DC) VIRatio II IOZ
6)7)
8)
Any input 0 V VIN VDD; All other pins not under test = 0 V9) DQs are disabled; 0 V VOUT VDDQ 9) VOUT = 1.95 V VOUT = 0.35 V
Output High Current, Normal IOH Strength Driver Output Low Current, Normal IOL Strength Driver
1) 2) 3) 4) 5) 6) 7) 8)
9)
-40 C TA 85 C; VDDQ = 2.5 V 0.2 V, VDD = +2.5 V 0.2 V; DDR400 conditions apply for all clock frequencies above 166 MHz Under all conditions, VDDQ must be less than or equal to VDD. Peak to peak AC noise on VREF may not exceed 2% VREF.DC. VREF is also expected to track noise variations in VDDQ. VTT is not applied directly to the device. VTT is a system supply for signal termination resistors, is expected to be set equal to VREF, and must track variations in the DC level of VREF. Inputs are not recognized as valid until VREF stabilizes. VID is the magnitude of the difference between the input level on CK and the input level on CK. The ratio of the pull-up current to the pull-down current is specified for the same temperature and voltage, over the entire temperature and voltage range, for device drain to source voltage from 0.25 to 1.0 V. For a given output, it represents the maximum difference between pull-up and pull-down drivers due to process variation. Values are shown per pin.
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HYI25D512160C[C/E/F/T] 512-Mbit Double-Data-Rate SDRAM
4.2
AC Characteristics
(Notes 1-5 apply to the following Tables; Electrical Characteristics and DC Operating Conditions, AC Operating Conditions, IDD Specifications and Conditions, and Electrical Characteristics and AC Timing.) Notes
www..com for AC timing, I 2. Tests
1. All voltages referenced to VSS. DD, and electrical, AC and DC characteristics, may be conducted at nominal reference/supply voltage levels, but the related specifications and device operation are guaranteed for the full voltage range specified. 3. Figure 3 represents the timing reference load used in defining the relevant timing parameters of the part. It is not intended to be either a precise representation of the typical system environment nor a depiction of the actual load presented by a production tester. System designers will use IBIS or other simulation tools to correlate the timing reference load to a system environment. Manufacturers will correlate to their production test conditions (generally a coaxial transmission line terminated at the tester electronics). 4. AC timing and IDD tests may use a VIL to VIH swing of up to 1.5 V in the test environment, but input timing is still referenced to VREF (or to the crossing point for CK, CK), and parameter specifications are guaranteed for the specified AC input levels under normal use conditions. The minimum slew rate for the input signals is 1 V/ns in the range between VIL(AC) and VIH(AC). 5. The AC and DC input level specifications are as defined in the SSTL_2 Standard (i.e. the receiver effectively switches as a result of the signal crossing the AC input level, and remains in that state as long as the signal does not ring back above (below) the DC input LOW (HIGH) level). 6. For System Characteristics like Setup & Holdtime Derating for Slew Rate, I/O Delta Rise/Fall Derating, DDR SDRAM Slew Rate Standards, Overshoot & Undershoot specification and Clamp V-I characteristics see the latest Industry specification for DDR components.
FIGURE 3
AC Output Load Circuit Diagram / Timing Reference Load
VTT
50 Output (VOUT) Timing Reference Point 30 pF
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HYI25D512160C[C/E/F/T] 512-Mbit Double-Data-Rate SDRAM
TABLE 19
AC Operating Conditions
Parameter Symbol Min.
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Values Max. -- VREF - 0.31 VDDQ + 0.6 0.5 x VDDQ+ 0.2
Unit
Note/ Test Condition
1)2)3) 1)2)3) 1)2)3)4) 1)2)3)5)
Input High (Logic 1) Voltage, DQ, DQS and DM Signals Input Low (Logic 0) Voltage, DQ, DQS and DM Signals Input Differential Voltage, CK and CK Inputs Input Closing Point Voltage, CK and CK Inputs
VIH(AC) VIL(AC) VID(AC) VIX(AC)
VREF + 0.31 -- 0.7 0.5 x VDDQ- 0.2
V V V V
1) 2) 3) 4) 5)
VDDQ = 2.5 V 0.2 V, VDD = +2.5 V 0.2 V (DDR200 - DDR333); VDDQ = 2.6 V 0.1 V, VDD = +2.6 V 0.1 V (DDR400); -40 C TA 85 C Input slew rate = 1 V/ns. Inputs are not recognized as valid until VREF stabilizes. VID is the magnitude of the difference between the input level on CK and the input level on CK. The value of VIX is expected to equal 0.5 x VDDQ of the transmitting device and must track variations in the DC level of the same.
TABLE 20
AC Timing - Absolute Specifications for PC3200 and PC2700
Parameter Symbol -5 DDR400B Min. DQ output access time from CK/CK CK high-level width Clock cycle time Max. +0.5 0.55 8 12 12 0.55 -6 DDR333 Min. -0.7 0.45 6 6 7.5 0.45 Max. +0.7 0.55 12 12 12 0.55 ns
2)3)4)5)
Unit Note1)/ Test Condition
tAC tCH tCK
-0.5 0.45 5 6 7.5
tCK
ns ns ns
2)3)4)5)
CL = 3.0 2)3)4)5) CL = 2.5 2)3)4)5) CL = 2.0 2)3)4)5)
2)3)4)5) 2)3)4)5)6)
CK low-level width Auto precharge write recovery + precharge time DQ and DM input hold time DQ and DM input pulse width (each input) DQS output access time from CK/CK
tCL tDAL tDH tDIPW tDQSCK
0.45 (tWR/tCK)+(tRP/tCK) 0.4 1.75 -0.6 0.35 -- --
tCK tCK
ns ns ns
-- -- +0.6 -- +0.40 +0.40 1.25
0.45 1.75 -0.6 0.35 -- -- 0.75
-- -- +0.6 -- +0.40 +0.45 1.25
2)3)4)5) 2)3)4)5)6)
2)3)4)5)
DQS input low (high) pulse width tDQSL,H (write cycle) DQS-DQ skew (DQS and associated DQ signals)
tCK
ns ns
2)3)4)5)
tDQSQ
TFBGA
2)3)4)5)
TSOPII
2)3)4)5) 2)3)4)5)
Write command to 1st DQS latching transition
tDQSS
0.72
tCK
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HYI25D512160C[C/E/F/T] 512-Mbit Double-Data-Rate SDRAM
Parameter
Symbol
-5 DDR400B Min. Max. -- -- -- -- +0.7 -- -- -- -- -- +0.70 -- -- +0.50 +0.50 -- 70E+3 -- -- 7.8 -- -- 1.1 0.60 -- --
-6 DDR333 Min. 0.45 0.2 0.2 min. (tCL, tCH) -0.7 0.75 0.8 2.2 0.75 0.8 -0.70 2 Max. -- -- -- -- +0.7 -- -- -- -- -- +0.70 -- -- +0.50 +0.55 -- 70E+3 -- -- 7.8 -- -- 1.1 0.60 -- --
Unit Note1)/ Test Condition
DQ and DM input setup time DQS falling edge hold time from
www..com cycle) CK (write
tDS tDSH tDSS tHP tHZ tIH
0.4 0.2 0.2 min. (tCL, tCH) -- 0.6 0.7
ns
2)3)4)5) 2)3)4)5)
tCK tCK
ns ns ns ns ns ns ns ns
DQS falling edge to CK setup time (write cycle) Clock Half Period Data-out high-impedance time from CK/CK Address and control input hold time
2)3)4)5)
2)3)4)5) 2)3)4)5)7)
fast slew rate
3)4)5)6)8)
slow slew rate3)4)5)6)8)
2)3)4)5)9)
Control and Addr. input pulse width (each input) Address and control input setup time
tIPW tIS
2.2 0.6 0.7
fast slew rate
3)4)5)6)8)
slow slew rate3)4)5)6)8)
2)3)4)5)7)
Data-out low-impedance time from CK/CK
tLZ
-0.7 2
Mode register set command cycle tMRD time DQ/DQS output hold time Data hold skew factor
tCK
ns ns ns ns ns ns ns s ns ns
2)3)4)5)
tQH tQHS
tHP -tQHS
-- --
tHP -tQHS
-- --
2)3)4)5)
TFBGA
2)3)4)5)
TSOPII
2)3)4)5) 2)3)4)5) 2)3)4)5) 2)3)4)5)
Active to Autoprecharge delay Active to Precharge command Active to Active/Auto-refresh command period Active to Read or Write delay
tRAP tRAS tRC
tRCD
40 55 15 -- 65 15 0.9 0.40 10 0.25
tRCD
42 60 18 -- 72 18 0.9 0.40 12 0.25
tRCD Average Periodic Refresh Interval tREFI Auto-refresh to Active/AutotRFC
refresh command period Read preamble Read postamble Active bank A to Active bank B command Write preamble Precharge command period
2)3)4)5) 2)3)4)5)8) 2)3)4)5)
tRP tRPRE tRPST tRRD tWPRE
2)3)4)5) 2)3)4)5) 2)3)4)5) 2)3)4)5)
tCK tCK
ns
tCK
2)3)4)5)
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Parameter
Symbol
-5 DDR400B Min. Max. -- 0.60 -- -- --
-6 DDR333 Min. 0 0.40 15 1 75 Max. -- 0.60 -- -- --
Unit Note1)/ Test Condition
Write preamble setup time Write postamble
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Write recovery time Internal write to read command delay Exit self-refresh to non-read command
tWPRES tWPST tWR tWTR tXSNR
0 0.40 15 2 75
ns
2)3)4)5)10) 2)3)4)5)11) 2)3)4)5) 2)3)4)5)
tCK
ns
tCK
ns
2)3)4)5)
2) Input slew rate 1 V/ns for DDR400, DDR333 3) The CK/CK input reference level (for timing reference to CK/CK) is the point at which CK and CK cross: the input reference level for signals other than CK/CK, is VREF. CK/CK slew rate are 1.0 V/ns. 4) Inputs are not recognized as valid until VREF stabilizes. 5) The Output timing reference level, as measured at the timing reference point indicated in AC Characteristics (note 3) is VTT. 6) For each of the terms, if not already an integer, round to the next highest integer. tCK is equal to the actual system clock cycle time. 7) tHZ and tLZ transitions occur in the same access time windows as valid data transitions. These parameters are not referred to a specific voltage level, but specify when the device is no longer driving (HZ), or begins driving (LZ). 8) Fast slew rate 1.0 V/ns , slow slew rate 0.5 V/ns and < 1 V/ns for command/address and CK & CK slew rate > 1.0 V/ns, measured between VIH(ac) and VIL(ac). 9) These parameters guarantee device timing, but they are not necessarily tested on each device. 10) The specific requirement is that DQS be valid (HIGH,LOW, or some point on a valid transition) on or before this CK edge. A valid transition is defined as monotonic and meeting the input slew rate specificationsof the device. When no writes were previously in progress on the bus, DQS will be transitioning from Hi-Z to logic LOW. If a previous write was in progress, DQS could be HIGH, LOW at this time, depending on tDQSS. 11) The maximum limit for this parameter is not a device limit. The device operates with a greater value for this parameter, but system performance (bus turnaround) degrades accordingly.
2)3)4)5) Exit self-refresh to read command tXSRD 200 -- 200 -- tCK 1) -40 C TA 85 C; VDDQ = 2.5 V 0.2 V, VDD = +2.5 V 0.2 V (DDR333); VDDQ = 2.6 V 0.1 V, VDD = +2.6 V 0.1 V (DDR400)
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TABLE 21
IDD Conditions
Parameter Operating Current: one bank; active/ precharge; tRC = tRCMIN; tCK = tCKMIN; DQ, DM, and DQS inputs changing once per clock cycle; address and control inputs changing once every two clock cycles. www..com Operating Current: one bank; active/read/precharge; Burst = 4; Refer to the following page for detailed test conditions. Precharge Power-Down Standby Current: all banks idle; power-down mode; CKE VILMAX; tCK = tCKMIN Symbol
IDD0
IDD1 IDD2P
Precharge Floating Standby Current: CS VIHMIN, all banks idle; IDD2F CKE VIHMIN; tCK = tCKMIN, address and other control inputs changing once per clock cycle, VIN = VREF for DQ, DQS and DM. Precharge Quiet Standby Current: CS VIHMIN, all banks idle; CKE VIHMIN; tCK = tCKMIN, address and other control inputs stable at VIHMIN or VILMAX; VIN=VREF for DQ, DQS and DM. Active Power-Down Standby Current: one bank active; power-down mode; CKE VILMAX; tCK= tCKMIN; VIN = VREF for DQ, DQS and DM.
IDD2Q IDD3P
Active Standby Current: one bank active; CS VIHMIN; CKE VIHMIN; tRC = tRASMAX; tCK = tCKMIN; DQ, DM and DQS IDD3N inputs changing twice per clock cycle; address and control inputs changing once per clock cycle Operating Current: one bank active; Burst = 2; reads; continuous burst; address and control inputs changing once per clock cycle; 50% of data outputs changing on every clock edge; CL = 2 for DDR200 and DDR266A, CL = 3 for DDR333; tCK = tCKMIN; IOUT = 0 mA Operating Current: one bank active; Burst = 2; writes; continuous burst; address and control inputs changing once per clock cycle; 50% of data outputs changing on every clock edge; CL = 2 for DDR200 and DDR266A, CL = 3 for DDR333; tCK = tCKMIN Auto-Refresh Current: tRC = tRFCMIN, burst refresh Self-Refresh Current: CKE 0.2 V; external clock on; tCK = tCKMIN Operating Current: four bank; four bank interleaving with BL = 4; Refer to the following page for detailed test conditions.
IDD4R
IDD4W
IDD5 IDD6 IDD7
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TABLE 22
IDD Specification
-6 DDR333 Symbol www..com IDD0 IDD1 IDD2P IDD2F IDD2Q IDD3P IDD3N IDD4R IDD4W IDD5 IDD6 Typ. 70 80 1.1 21 15 11 33 95 100 130 1.6 190 Max. 85 95 4.6 25 22 15 40 115 120 175 5 230 -5 DDR400B Typ. 75 90 1.1 25 17 12 38 110 115 145 1.6 210 Max. 90 110 4.6 30 23 16 45 135 135 190 5 250 mA mA mA mA mA mA mA mA mA mA mA mA
1)2)3) 1)2)3) 1)3) 1)3) 1)3) 1)3) 1)3) 1)3) 1)3) 1)3) 1)3)4) 1)3)
Unit
Note
IDD7
1) Test conditions for typical values: VDD = 2.5 V (DDR333), VDD = 2.6 V (DDR400), TA = 25 C, test conditions for maximum values: VDD = 2.7 V, TA = 10 C 2) IDD specifications are tested after the device is properly initialized and measured at 200 MHz 3) Input slew rate = 1 V/ns 4) Enables on-chip refresh and address counters
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5
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Package Outlines
There are two package types used for this product family each in lead-free and lead-containing assembly: * P-TFBGA: Plastic Thin Fine-Pitch Ball Grid Array Package
TABLE 23
TFBGA Common Package Properties (non-green/green)
Description Ball Size Recommended Landing Pad Recommended Solder Mask Size 0.460 0.350 0.450 Units mm mm mm
FIGURE 4
Package Outline P(G)-TFBGA-60-11
Notes 1. Drawing according to ISO 8015 2. Dimensions in mm 3. General tolerances +/- 0.15
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HYI25D512160C[C/E/F/T] 512-Mbit Double-Data-Rate SDRAM
* P-TSOPII: Plastic Thin Small Outline Package Type II
FIGURE 5
Package Outline of P(G)-TSOPII-66-1 (green/non-green)
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List of Figures
Figure 1 Figure 2 Figure 3 www..com Figure 4 Figure 5 Pin Configuration P(G)-TFBGA-60 Top View, see the balls throught the package . . . . . . . . . . . . . . . . . . . . . Pin Configuration P(G)-TSOPII-66 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . AC Output Load Circuit Diagram / Timing Reference Load . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Package Outline P(G)-TFBGA-60-11 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Package Outline of P(G)-TSOPII-66-1 (green/non-green) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 12 24 30 31
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HYI25D512160C[C/E/F/T] 512-Mbit Double-Data-Rate SDRAM
List of Tables
Table 1 Table 2 Table 3 www..com Table 4 Table 5 Table 6 Table 7 Table 8 Table 9 Table 10 Table 11 Table 12 Table 13 Table 14 Table 15 Table 16 Table 17 Table 18 Table 19 Table 20 Table 21 Table 22 Table 23 Performance for -5 and -6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Ordering Information for non RoHS Compliant Products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Ordering Information for RoHS Compliant Products. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Ball Configuration of DDR SDRAM. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Abbreviations for Pin Type . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Abbreviations for Buffer Type . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Mode Register Definition. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Burst Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Extended Mode Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Truth Table 1a: Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Truth Table 1b: DM Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Truth Table 2: Clock Enable (CKE). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Truth Table 3: Current State Bank n - Command to Bank n (same bank) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Truth Table 4: Current State Bank n - Command to Bank m . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Truth Table 5: Concurrent Auto Precharge. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Input and Output Capacitances . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Electrical Characteristics and DC Operating Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 AC Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 AC Timing - Absolute Specifications for PC3200 and PC2700. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 IDD Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 IDD Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 TFBGA Common Package Properties (non-green/green) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Rev. 1.0, 2006-11 11082006-S9OT-UFSN
33
Internet Data Sheet
HYI25D512160C[C/E/F/T] 512-Mbit Double-Data-Rate SDRAM
Table of Contents
www..com
1 1.1 1.2 2
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Chip Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 List of Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 List of Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
3 4 4.1 4.2 5
Rev. 1.00, 2006-11 11082006-S9OT-UFSN
34
Internet Data Sheet
www..com
Edition 2006-11 Published by Qimonda AG Gustav-Heinemann-Ring 212 D-81739 Munchen, Germany (c) Qimonda AG 2006. All Rights Reserved. Legal Disclaimer The information given in this Internet Data Sheet shall in no event be regarded as a guarantee of conditions or characteristics ("Beschaffenheitsgarantie"). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Qimonda hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Qimonda Office. Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Qimonda Office. Qimonda Components may only be used in life-support devices or systems with the express written approval of Qimonda, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. www.qimonda.com

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